Company Details

  • Shenzhen Bente Circuit Limited

  •  [Guangdong,China]
  • Business Type:Distributor/Wholesaler , Manufacturer , Service
  • Main Mark: Americas , Caribbean , East Europe , Europe , North Europe , Oceania , West Europe , Africa , Asia , Middle East , Other Markets , Worldwide
  • Exporter:91% - 100%
  • Certs:ISO9001, ISO14001, RoHS, ISO/TS16949, UL
  • Description:HDI PCB ENIG PCB Assembly,HDI PCB FR4 PCB Assembly,HDI PCB BGA PCB Assembly
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Shenzhen Bente Circuit Limited

HDI PCB ENIG PCB Assembly,HDI PCB FR4 PCB Assembly,HDI PCB BGA PCB Assembly

Home > Products > HDI PCB > 8 Layers HDI PCB FR4 Tg170 ENIG 3U" BGA Buried/Blind Hole

8 Layers HDI PCB FR4 Tg170 ENIG 3U" BGA Buried/Blind Hole

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    Payment Type: L/C,T/T,D/P,Paypal,Money Gram,Western Union
    Incoterm: FOB,CFR,CIF,FCA,CPT,CIP
    Min. Order: 1 Piece/Pieces
    Delivery Time: 5 Days

Basic Info

Type: Rigid Circuit Board

Dielectric: FR-4

Base Material: Copper

Mechanical Rigid: Rigid

Category: HDI PCB

Layers: 8 Layers

Material: FR4,Tg170, Paper Phenolic Copper Foil Substrate

Thickness: 1.6mm±0.13mm

Surface Treatment: ENIG 3U"

Finished Copper: 1oz

Min.Line Width/Space: 5/5mil

Minimum Hole: 0.25mm

Hole Copper: 25um

Technical Features: Minimum PAD Of BGA Is 0.2mm, 5 BGA/PCS, Buried/Bli

Flame Retardant Properties: V0

Insulation Materials: Organic Resin

Processing Technology: Electrolytic Foil

Application: Medical Instruments

Brand: JC

Additional Info

Packaging: Vacuum-Packed

Productivity: 10000

Brand: BentePCB

Transportation: Ocean,Land,Air

Place of Origin: China

Certificate: ISO 9001

Product Description

Product Description:

What is PCB design, circuit prototyping, PCB free, PCB quote, PCB Prototype service, PCB products, etching circuit boards, making a Circuit Board, circuit board tester,pc board assembly.
8 Layers HDI PCB, Buried/Blind Hole, Bare board. Base Material is FR4 Tg170. Board Thickness is 1.6mm±0.13mm. Surface Treatment is ENIG 3U" . Technical Features is Minimum PAD of BGA is 0.2mm, 5 BGA/PCS, Buried/Blind Hole.
Ship by DHL, FEDEX, UPS, TNT or client specified. Pay with popular and secure payment methods, such as PayPal, Telegraphic Transfer, etc. Our PCB products are mainly used in these fields: Power Electronics, Communications, Industrial Control, Medical Electronics, Security Electronics, Consumer Electronics, Computer, Automotive Electronics, etc.

HDI PCB:

High Density Interconnects (HDI) are used to meet the market demand for complex designs in smaller form factors across the majority of market segments, (Wireless, Telecom, Military, Medical, Semiconductor, and Instrumentation).

HDI Circuit boards, one of the fastest growing technologies in PCBs, HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter.

They have finer lines and spaces always = <3mil They have a higher circuitry density than traditional circuit boards.

Andwin maintains years of experience with HDI products and was a pioneer of second generation microvias. now offer an entire family of microvia technology solutions for your next generation products.

Stack up of HDI PCB

Stack up of 1 Step HDI PCB

Stack up of 1 Step HDI PCB

Stack up of 2 step HDI PCB

Stack up of 2 step HDI PCB

Stack up of 2 steps HDI with blind via and buried via

Stack up of 2 steps HDI with blind via and buried via

Anylayer connect of HDI PCB, need to adjust drill

Anylayer connect of HDI PCB, need to adjust drill


About Us:

BentePCB is a professional PCB manufacturing which is focus on double side, multilayer, HDI PCB, rigid PCB and Flexible PCB mass production. The company was established on 2011.
We have two factories together, The factory in Shenzhen is specialized in small and middle volume orders and the factory in Jiangxi is for big volume.

Why Us?

UL (E492586), ISO9001, ISO14001, TS16949, RoHS certified.
Turnover USD
10-50 million per year.
15,000 sqm area, 450 staff .
Mass Production from single to
16 layers.
Special Material:
ROGERS, Arlon, Taconic.etc.
Client:
Huawei, SAMSUNG, Malata, Midea,Texas Instruments.etc.


Certification(UL:E492586, TS16949, ISO14001, ISO9001,RoHS):

ISO9001,ISO14001UL:E492586

Factory Tour:

PCB Manufacturer

PCB Factory

PCB Manufacturing

Exhibition:

We Took part in the famous exhibitions over the past years,and got highly appreciation from the top experts,as well as cooperated tightly with them.

Exhibition

Delivery:

BentePCB offers flexible shipping methods for our customers, you may choose from one of the methods below.
Delivery

PCB China

We don`t just sell PCBs .We sell sleep.

Contact Us

Looking for ideal HDI PCB ENIG PCB Assembly Manufacturer & supplier ? We have a wide selection at great prices to help you get creative. All the HDI PCB FR4 PCB Assembly are quality guaranteed. We are China Origin Factory of HDI PCB BGA PCB Assembly. If you have any question, please feel free to contact us.

Product Categories : HDI PCB

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  • 8 Layers HDI PCB FR4 Tg170 ENIG 3U" BGA Buried/Blind Hole
  • 8 Layers HDI PCB FR4 Tg170 ENIG 3U" BGA Buried/Blind Hole
  • 8 Layers HDI PCB FR4 Tg170 ENIG 3U" BGA Buried/Blind Hole
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