Shenzhen Bente Circuit Limited
Type: Rigid Circuit Board
Base Material: Copper
Mechanical Rigid: Rigid
Category: HDI PCB
Layers: 8 Layers
Material: FR4,Tg170, Paper Phenolic Copper Foil Substrate
Surface Treatment: ENIG 3U"
Finished Copper: 1oz
Min.Line Width/Space: 5/5mil
Minimum Hole: 0.25mm
Hole Copper: 25um
Technical Features: Minimum PAD Of BGA Is 0.2mm, 5 BGA/PCS, Buried/Bli
Flame Retardant Properties: V0
Insulation Materials: Organic Resin
Processing Technology: Electrolytic Foil
Application: Medical Instruments
Place of Origin: China
Certificate: ISO 9001
What is PCB design, circuit prototyping, PCB free, PCB quote, PCB Prototype service, PCB products, etching circuit boards, making a Circuit Board, circuit board tester,pc board assembly.
8 Layers HDI PCB, Buried/Blind Hole, Bare board. Base Material is FR4 Tg170. Board Thickness is 1.6mm±0.13mm. Surface Treatment is ENIG 3U" . Technical Features is Minimum PAD of BGA is 0.2mm, 5 BGA/PCS, Buried/Blind Hole.
Ship by DHL, FEDEX, UPS, TNT or client specified. Pay with popular and secure payment methods, such as PayPal, Telegraphic Transfer, etc. Our PCB products are mainly used in these fields: Power Electronics, Communications, Industrial Control, Medical Electronics, Security Electronics, Consumer Electronics, Computer, Automotive Electronics, etc.
High Density Interconnects (HDI) are used to meet the market demand for complex designs in smaller form factors across the majority of market segments, (Wireless, Telecom, Military, Medical, Semiconductor, and Instrumentation).
HDI Circuit boards, one of the fastest growing technologies in PCBs, HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter.
They have finer lines and spaces always = <3mil They have a higher circuitry density than traditional circuit boards.
Andwin maintains years of experience with HDI products and was a pioneer of second generation microvias. now offer an entire family of microvia technology solutions for your next generation products.
Stack up of HDI PCB
Stack up of 1 Step HDI PCB
Stack up of 2 step HDI PCB
Stack up of 2 steps HDI with blind via and buried via
Anylayer connect of HDI PCB, need to adjust drill
BentePCB is a professional PCB manufacturing which is focus on double side, multilayer, HDI PCB, rigid PCB and Flexible PCB mass production. The company was established on 2011.
We have two factories together, The factory in Shenzhen is specialized in small and middle volume orders and the factory in Jiangxi is for big volume.
UL (E492586), ISO9001, ISO14001, TS16949, RoHS certified.
Turnover USD 10-50 million per year.
15,000 sqm area, 450 staff .
Mass Production from single to 16 layers.
Special Material:ROGERS, Arlon, Taconic.etc.
Client:Huawei, SAMSUNG, Malata, Midea,Texas Instruments.etc.
Certification(UL:E492586, TS16949, ISO14001, ISO9001,RoHS):
We Took part in the famous exhibitions over the past years,and got highly appreciation from the top experts,as well as cooperated tightly with them.
BentePCB offers flexible shipping methods for our customers, you may choose from one of the methods below.
We don`t just sell PCBs .We sell sleep.
Product Categories : HDI PCB
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