Shenzhen Bente Circuit Limited
Type: Rigid Circuit Board
Flame Retardant Properties: V0
Base Material: Copper
Insulation Materials: Organic Resin
Processing Technology: Electrolytic Foil
Mechanical Rigid: Rigid
Material: Fiberglass Epoxy, FR4,Tg150
Layers: 8 Layers
Surface Treatment: HASL LF
Finished Copper: 1oz
Min.Line Width/Space: 4.5/4mil
Technical Features: First-order Blind/Buried Via, High Tg, Via In Pad
Minimum BGA Pad: 0.23mm
Place of Origin: China
Certificate: ISO 9001
8 Layers HDI PCB, Process Characteristics are First-order Blind Buried Hole, High Tg, Plate Hole, The Field of Application is Aircraft, Minimum BGA Pad is 0.23mm, Surface Treatment is HASL LF, PCB Electronics, PCB Circuit Board, PCB Material.
BentePCB has obtained ISO9001: 2008 (No.51817Q01715R0S) quality management system certification, ISO14001: 2004 (Certification No .: 51817E01716R0S) environmental management system certification, SGS certification, the United States and European UL certification (UL No. E492586), TS16949 etc.
Good News: Every orders will get free SMT Stencil , please check out our website at www.bentepcb.com/onlinepcb.htm
High Density Interconnects (HDI) are used to meet the market demand for complex designs in smaller form factors across the majority of market segments, (Wireless, Telecom, Military, Medical, Semiconductor, and Instrumentation).
HDI Circuit boards, one of the fastest growing technologies in PCBs, HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter.
They have finer lines and spaces always = <3mil They have a higher circuitry density than traditional circuit boards.
Andwin maintains years of experience with HDI products and was a pioneer of second generation microvias. now offer an entire family of microvia technology solutions for your next generation products.
Stack up of HDI PCB
Stack up of 1 Step HDI PCB
Stack up of 2 step HDI PCB
Stack up of 2 steps HDI with blind via and buried via
Anylayer connect of HDI PCB, need to adjust drill
BentePCB is a professional PCB manufacturing which is focus on double side, multilayer, HDI PCB, rigid PCB and Flexible PCB mass production. The company was established on 2011.
We have two factories together, The factory in Shenzhen is specialized in small and middle volume orders and the factory in Jiangxi is for big volume.
UL (E492586), ISO9001, ISO14001, TS16949, RoHS certified.
Turnover USD 10-50 million per year.
15,000 sqm area, 450 staff .
Mass Production from single to 16 layers.
Special Material:ROGERS, Arlon, Taconic.etc.
Client:Huawei, SAMSUNG, Malata, Midea,Texas Instruments.etc.
Certification(UL:E492586, TS16949, ISO14001, ISO9001,RoHS):
We Took part in the famous exhibitions over the past years,and got highly appreciation from the top experts,as well as cooperated tightly with them.
BentePCB offers flexible shipping methods for our customers, you may choose from one of the methods below.
We don`t just sell PCBs .We sell sleep.
Product Categories : HDI PCB
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